The full package render of AMD’s Zen 4 powered Raphael Ryzen Desktop CPUs for the upcoming AM5 platform has been unveiled by ExecutableFix. The leaker had previously shown us a mockup of the LGA 1718 contact pads featured beneath the next-gen mainstream desktop processors.
AMD Zen 4 Powered Ryzen Raphael Desktop CPUs For AM5 LGA 1718 Platform Pictured In Latest Renders, Package Design Detailed
We knew that with the AM5 platform, AMD is going to offer a brand new socket in the form of LGA 1718. The new socket will be specifically designed for the Zen 4 powered Ryzen ‘Raphael’ Desktop CPUs and while we have seen the renders of the contact pads, now we get a detailed look at what is to be the full package of the Zen 4 processors.
AMD Ryzen ‘Rapahel’ Zen 4 Desktop CPU Package Pictures (Image Credits: ExecutableFix):
As the images reveal, the AMD Ryzen Raphael Desktop CPUs will feature a perfect square shape (45x45mm) but will house a very chonky integrated heat spreader or IHS. The particular reasoning behind it being so dense is unknown but it could be to balance out the thermal load across multiple chiplets or some entirely another purpose. The sides are similar to the IHS featured on the Intel Core-X line of HEDT CPUs.
We can’t tell if the two partitions on each side are cut-outs or merely reflections from the render but in the case of these being cut-outs, we can expect the thermal solution has been designed to vent air out but that would mean that hot air would blow out towards VRMs of the motherboards or become trapped within this central chamber. Again this is mere speculation so let’s wait and see the final design of the chip and remember that this is a mockup render so final design could end up much different.
AMD Ryzen ‘Rapahel’ Zen 4 Desktop CPU Contact Pad Pictures (Image Credits: ExecutableFix):
Here’s Everything We Know About AMD’s Raphael Ryzen ‘Zen 4’ Desktop CPUs
The next-generation Zen 4 based Ryzen Desktop CPUs will be codenamed Raphael and will replace the Zen 3 based Ryzen 5000 Desktop CPUs that are codenamed, Vermeer. From the information we currently have, Raphael CPUs will be based on the 5nm Zen 4 core architecture & will feature 6nm I/O dies in a chiplet design. AMD has hinted at upping the core counts of its next-gen mainstream desktop CPUs so we can expect a slight bump from the current max of 16 cores and 32 threads.
AMD Ryzen Raphael ‘Zen 4’ Desktop CPU Expected Features:
- Brand New Zen 4 CPU Cores (IPC / Architectural Improvements)
- Brand New TSMC 5nm process node with 6nm IOD
- Support on AM5 Platform With LGA1718 Socket
- Dual-Channel DDR5 Memory Support
- 28 PCIe Gen 4.0 Lanes (CPU Exclusive)
- 105-120W TDPs (Upper Bound Range ~170W)
The brand new Zen 4 architecture is rumored to deliver up to 25% IPC gain over Zen 3 and hit clock speeds of around 5 GHz.
‘Mark, Mike, and the teams have done a phenomenal job. We are as good as we are with the product today, but with our ambitious roadmaps, we are focusing on Zen 4 and Zen 5 to be extremely competitive.
‘There will be more core counts in the future – I would not say those are the limits! It will come as we scale the rest of the system.’
AMD CEO, Dr. Lisa Su via Anandtech
AMD’s Rick Bergman on Next-Gen Zen 4 Cores For Ryzen CPUs
Q- How much of the performance gains delivered by AMD’s Zen 4 CPUs, which are expected to use a 5nm TSMC process and might arrive in early 2022, will come from instructions per clock (IPC) gains as opposed to core count and clock speed increases.
Bergman: “[Given] the maturity of the x86 architecture now, the answer has to be, kind of, all of the above. If you looked at our technical document on Zen 3, it was this long list of things that we did to get that 19% [IPC gain]. Zen 4 is going to have a similar long list of things, where you look at everything from the caches, to the branch prediction, [to] the number of gates in the execution pipeline. Everything is scrutinized to squeeze more performance out.”
“Certainly [manufacturing] process opens an additional door for us to [obtain] better performance-per-watt and so on, and we’ll take advantage of that as well.”
The complete leaked AMD Desktop & Mobility Ryzen CPU roadmap compiled by @Olrak29_
As for the platform itself, the AM5 motherboards will feature the LGA1718 socket which is going to last quite some time. The platform will feature DDR5-5200 memory, 28 PCIe Gen 4.0 lanes, more NVMe 4.0 & USB 3.2 I/O, and may also ship with native USB 4.0 support. The lineup is stated to get CPUs up to 170W (120W base TDP) on the AM5 platform.
The Raphael Ryzen Desktop CPUs are also expected to feature RDNA 2 onboard graphics which means that just like Intel’s mainstream desktop lineup, AMD’s mainstream lineup will also feature iGPU graphics support. The Zen 4 based Raphael Ryzen CPUs aren’t expected till late 2022 so there’s still a lot of time left in the launch. The lineup will compete against Intel’s Raptor Lake 13th Gen Desktop CPU lineup.
AMD Zen CPU / APU Roadmap:
| Zen Architecture | Zen 1 | Zen+ | Zen 2 | Zen 3 | Zen 3+ | Zen 4 | Zen 5 |
|---|---|---|---|---|---|---|---|
| Process Node | 14nm | 12nm | 7nm | 7nm | 6nm? | 5nm | 3nm? |
| Server | EPYC Naples (1st Gen) | N/A | EPYC Rome (2nd Gen) | EPYC Milan (3rd Gen) | N/A | EPYC Genoa (4th Gen) | EPYC Turin (5th Gen) |
| High-End Desktop | Ryzen Threadripper 1000 (White Haven) | Ryzen Threadripper 2000 (Coflax) | Ryzen Threadripper 3000 (Castle Peak) | Ryzen Threadripper 5000 (Chagal) | N/A | Ryzen Threadripper 6000 (TBA) | TBA |
| Mainstream Desktop CPUs | Ryzen 1000 (Summit Ridge) | Ryzen 2000 (Pinnacle Ridge) | Ryzen 3000 (Matisse) | Ryzen 5000 (Vermeer) | Ryzen 6000 (Warhol / Cancelled) | Ryzen 7000 (Raphael) | Ryzen 8000 (Granite Ridge) |
| Mainstream Desktop . Notebook APU | Ryzen 2000 (Raven Ridge) | Ryzen 3000 (Picasso) | Ryzen 4000 (Renoir) Ryzen 5000 (Lucienne) |
Ryzen 5000 (Cezanne) Ryzen 6000 (Barcelo) |
Ryzen 6000 (Rembrandt) | Ryzen 7000 (Phoenix) | Ryzen 8000 (Strix Point) |
| Low-Power Mobile | N/A | N/A | Ryzen 5000 (Van Gogh) Ryzen 6000 (Dragon Crest) |
TBA | TBA | TBA | TBA |
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