Packaging

ASUS ROG STRIX Z690I Gaming WiFi Motherboard Packaging Pictured, SFF ITX Design For Intel’s Alder Lake CPUs

ASUS’s upcoming ROG STRIX Z690-I Gaming WiFi motherboard which comes in a Mini-ITX form factor has leaked out and was spotted by Harukaze5719. ASUS ROG STRIX Z690-I Gaming WiFi Motherboard Pictured, LGA 1700 Socket For Intel Alder Lake CPUs on an SFF ITX Board The ASUS ROG STRIX Z690-I Gaming WiFi motherboard features an ITX …

ASUS ROG STRIX Z690I Gaming WiFi Motherboard Packaging Pictured, SFF ITX Design For Intel’s Alder Lake CPUs Read More »

TSMC Roadmap Lays Out Advanced CoWoS Packaging Technologies, Ready For Next-Gen Chiplet Architectures & HBM3 Memory

TSMC has laid out its advanced packaging technology roadmap and showcased its next-gen CoWoS solutions which are ready for next-gen chiplet architectures and memory solutions. TSMC Lays Out Its Advanced CoWoS Packaging Technology Roadmap, 2023 Design Ready For Chiplet & HBM3 Architectures The Taiwanese-based semiconductor giant has gained rapid progress in deploying advanced chip packaging …

TSMC Roadmap Lays Out Advanced CoWoS Packaging Technologies, Ready For Next-Gen Chiplet Architectures & HBM3 Memory Read More »

AMD EPYC Milan-X CPUs Allegedly Pack X3D Packaging Technology & Stacked Zen 3 Chiplets

AMD is allegedly stated to offer a brand new lineup of X3D MCM chips within its 3rd Gen EPYC Milan CPU stack which will be unlike anything they have done before. These new processors are seemingly going to be known as Milan-X and will be the next step in the evolution of AMD’s CPUs using …

AMD EPYC Milan-X CPUs Allegedly Pack X3D Packaging Technology & Stacked Zen 3 Chiplets Read More »

Intel Showcases Its Packaging Prowess With 7nm Ponte Vecchio Xe-HPC GPU, Over 100 Billion Transistors

Yesterday, during the Intel unleashed webcast, CEO, Pat Gelsinger, unveiled new details of the 7nm Xe-HPC-based Ponte Vecchio GPU which is planned to be the largest and most chip designed to date. The Ponte Vecchio GPU will be making use of several key technologies that were highlighted which will power 47 different compute tiles based …

Intel Showcases Its Packaging Prowess With 7nm Ponte Vecchio Xe-HPC GPU, Over 100 Billion Transistors Read More »

Xbox Series S “Lockhart” Seemingly Confirmed Through Leaked ‘Robot White’ Controller Packaging for Microsoft’s Next-gen Consoles

Microsoft’s rumored Xbox Series S, codenamed ‘Lockhart’, appears to have been confirmed via a leaked Xbox Series X controller packaging. A lot has been written about Microsoft’s ‘budget’ version of the Series X, the Series S. Up till now, Microsoft has always denied that another console is in development, but there have been too many …

Xbox Series S “Lockhart” Seemingly Confirmed Through Leaked ‘Robot White’ Controller Packaging for Microsoft’s Next-gen Consoles Read More »

Intel Revises Core i9-9900K Packaging To Traditional Box Shaped, Drops Limited Dodecahedron Design

Intel has posted a product change notice (PCN) in regard to the packaging of the Core i9-9900K. This processor originally had a very extravagant packaging which set it apart from other processors that all came in the same boxed shaped package. This processor’s packaging with a dodecahedron design did look fantastic but made shipping and …

Intel Revises Core i9-9900K Packaging To Traditional Box Shaped, Drops Limited Dodecahedron Design Read More »

NVIDIA May Potentially Utilize TSMC’s CoWoS Packaging for the Next-Generation GPUs

Source: NVIDIA NVIDIA could possibly be among one of the three significant clients that will make use of TSMC’s CoWoS packaging, the other two clients being Xilinx and HiSilicon, according to a new report by DigiTimes. CoWoS, or Chip-on-Wafer-on-Substrate, is a 2.5D packaging technology that integrates multiple chiplets onto a single interposer. This new packaging …

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AMD 3rd Generation Ryzen Threadripper Space Age Style Packaging Leaked

A featured image of the first generation AMD Threadripper 1950X. Videocardz has done it again, leaking the box packaging of the upcoming Ryzen Threadripper 3000 series a day before the rumored launch of the platform. AMD has always been very innovative with its design of the packaging and the first Threadripper set some pretty high …

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