SK Hynix has announced that it has become the first in the industry to develop the next-generation High Bandwidth Memory standard, HBM3. SK Hynix First To Complete HBM3 Development: Up To 24 GB In 12-Hi Stack, 819 GB/s Bandwidth According to SK Hynix, the company has successfully developed its HBM3 DRAM, marking the next generation …
Up To 24 GB Capacities, 12-Hi Stacks & 819 GB/s Bandwidth Read More »
AMD’s next-generation EPYC Milan-X CPUs which will feature 3D Chiplet packaging has leaked out by Momomo_US. The lineup will serve as an intermediary solution before the Zen 4 powered EPYC Genoa lineup arrives later in 2022-2023. AMD’s EPYC Milan-X Server CPU SKUs Leak Out, Up To 64 Cores With 3D V-Cache Technology? AMD has so …
AMD EPYC Milan-X Server CPUs Leak Out, Up To 64 Zen 3 Cores & Possibly 3D V-Cache Stacks Read More »
Intel has disclosed the first information regarding its Sapphire Rapids-SP Xeon CPUs which will be featuring HBM2E memory stacks alongside the main core dies in a multi-chiplet design. Intel Sapphire Rapids-SP Xeon CPUs Pack 4 HBM2E Dies With 8-Hi Stacks In A Chiplet Design, Fused Together With Main Core Dies Using EMIB We have already …
As it gets thrust right in the center of trade tensions between the United States and China, Taiwanese semiconductor fabrication company TSMC is busy showcasing advanced manufacturing and packaging technologies. In its technology symposium that kicked off at the start of this week, the company announced key details for its semiconductor fabrication techniques and packaging …
TSMC Talks 5nm, 3nm & 12 HBM Stacks In One Package At Tech Symposium Read More »